华邦ISD/WinbondISD语音芯片厂家产品选型目录

华邦ISD/WinbondISD语音芯片厂家产品选型目录

品牌Logo	产品型号秒数	产品特性相关	出货形式	类别	更多简介

华邦 ISD/WinbondISD	ISD18B12	Duration: 6- 12 sec 秒;Sample Rate (kHz): 4.0~8.0	DIE/DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB18B00
华邦 ISD/WinbondISD	ISD1810	Duration: 8-16 sec 秒;Sample Rate (kHz): 4.0~8.0; Temperature Options: 0 - 50°C	DIE/DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-ES1810
华邦 ISD/WinbondISD	ISD1806	Duration: 6-12 sec 秒;Sample Rate (kHz): 4.0~8.0; Temperature Options: 0 - 50°C	DIE/DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-ES1810
华邦 ISD/WinbondISD	ISD17240	Duration: 160-480 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB17240 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD17210	Duration: 140-420 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB17210 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD17180	Duration: 120-360 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB17180 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD17150	Duration: 100-300 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB17150 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD17120	Duration: 80-240 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB17120 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD1790	Duration: 60-180 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB1790 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD1760	Duration: 40-120 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB1760 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD1750	Duration: 33-100 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB1750 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD1740	Duration: 26-80 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB1740 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD1730	Duration: 20-60 sec 秒;Sample Rate (kHz): 4.0~12.0	DIP 28; SOIC 28; TSOP 28; DIE/DIP 28; SOIC 28; TSOP 28; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: ISD-COB1730 ISD-ES17xx_USB_PB
华邦 ISD/WinbondISD	ISD1620B	Duration: 13.3-40 sec 秒;Sample Rate (kHz): 4.0~12.0	SOIC 16; DIE/SOIC 16; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: I16-COB20; I16-COB00
华邦 ISD/WinbondISD	ISD1616B	Duration: 10.6-32 sec 秒;Sample Rate (kHz): 4.0~12.0	SOIC 16;DIE/SOIC 16;DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: I16-COB20; I16-COB00
华邦 ISD/WinbondISD	ISD1612B	Duration: 8-24 sec 秒;Sample Rate (kHz): 4.0~12.0	SOIC 16; DIE/SOIC 16; DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: I16-COB20; I16-COB00
华邦 ISD/WinbondISD	ISD1610B	Duration: 6.6-20 sec 秒;Sample Rate (kHz): 4.0~12.0	SOIC 16 ;DIE/SOIC 16 ;DIE	Mask IC	Status*: P; RoHS: Y; Development Tools: I16-COB20;I16-COB00

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